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Web12 jun. 2024 · The principle difference between the two processes is that the aluminum wire is bonding in an Ultrasonic (U/S) bonding process at 25C (room temperature), whereas gold wire is performed through a Thermosonic (T/S) bonding process with a high temperature of 150C on the substrate or package. WebTHE 5600Ci. >> The automatic bond tester 5600Ci complements F&S Bondtec Semiconductor GmbH die- and wire-bonders. It is unique on the world market and … WebDie Bonding. In back-end semiconductor manufacturing, the die attach process is a critical step. At first glance, die attach seems to be a simple process step in the semiconductor manufacturing chain. However, the continuously increasing requirements of today's applications set high standards in die bonding. free ifit programs